A. Iron
B. Aluminium
C. Carbon
D Silver
Which of the following is used in heat sink_____________? Read More »
Power Electronics A. Use of snubber circuit.
B. Using heat sink.
C. Using CB and fuse.
D. Using equalizing circuit
How can we protect SCR from thermal conditions _____________? Read More »
Power Electronics A. Controlled transistor
B. Controlled switch
C. Amplifier with higher gain
D. Amplifier with large current gain
Thyristor is nothing but a____________? Read More »
Power Electronics A. lower power circuit.
B. high power circuit.
C. magnetic circuit.
D. may be low power or high power circuit
Gate circuit or triggering circuit of a thyristor is Read More »
Power Electronics A. gate signal is always present
B. gate signal must be removed
C. gate signal should present but can be removed
D. none of the above.
After proper turn on of thyristor____________? Read More »
Power Electronics A. < latching current but greater than holding current and gate signal is 0.
B. less than holding current.
C. < latching current but greater than holding current and gate signal is present.
D. both (A) and (B).
SCR will be turned off when anode current is_______________? Read More »
Power Electronics A. 600 V/µs
B. 800 V/µs
C. 1200 V/µs
D. 1000 V/µs
A. High power phase control
B. High power current control
C. Low power current control
D. Low power phase control
BCT is used for____________? Read More »
Power Electronics A. Vc1 > Vc2 > Vc3 when Ig1 > Ig2 > Ig3.
B. Vc1 > Vc2 > Vc3 when Ig1 < Ig2 < Ig3.
C. Vc1 = Vc2 = Vc3 any value of Ig.
D. Vc1 > Vc2 > Vc3 when Ig1 ≥ Ig2 &Atil
A. SIT
B. SITH
C. GTO
D. SCR
Which of following devices has highest di/dt and dv/dt capability? Read More »
Power Electronics