A. Iridium
B. Ruthinium
C. Indium
D. Platinum
A. Iridium
B. Ruthinium
C. Indium
D. Platinum
A. Supracocclusion of restoration
B. Retained cement in gingival sulcus
C. Excess acid in mix
D. Galvanic current caused by gold onlay occluding with a large restoration
A. 0%
B. 2 to 3%
C. 5 to 10%
D. <1%
A. To felicitate wetting of ring liner
B. To felicitate mixing investment
C. To reduce contact angle of liquid with max surface
D. For better wax elimination
A. Palladium
B. Silver
C. Copper
D. Zinc
A. It prevents the formation of copper oxide
B. It prevents the formation of chromium oxide or dissolves chromic oxide layer
C. It prevents the flow of material in undesirable area
D. Increase the strength of solder
A. N 25%
B. 25%
C. >40%
D. 0%
A. Suckback porosity
B. Gas inclusion porosity
C. Localized shrinkage porosity
D. Microporosity
A. Prevent the oxidation of the metal during melting
B. increase the melting point of the flux
C. Flaring the point of the sprue attachment
D. None of the above
A. Candellila wax
B. Paraffin wax
C. Carnauba wax
D. Gum dammar